Mems And Microsystems: Design, Manufacture, And Nanoscale Engineering, Second Edition 9780470083017 下载 pdf 百度网盘 epub 免费 2025 电子版 mobi 在线

　　Technology/Engineering/Mechanical

A bestselling MEMS text...now better than ever.

An engineering design approach to Microelectromechanical Systems,

MEMS and Microsystems remains the only available text to cover both

the electrical and the mechanical aspects of the technology. In the

five years since the publication of the first edition, there have

been significant changes in the science and technology of

miniaturization, including microsystems technology and

nanotechnology. In response to the increasing needs of engineers to

acquire basic knowledge and experience in these areas, this popular

text has been carefully updated, including an entirely new section

on the introduction of nanoscale engineering.

Following a brief introduction to the history and evolution of

nanotechnology, the author covers the fundamentals in the

engineering design of nanostructures, including fabrication

techniques for producing nanoproducts, engineering design

principles in molecular dynamics, and fluid flows and heat

transmission in nanoscale substances.

Other highlights of the Second Edition include:

Expanded coverage of microfabrication plus assembly and packaging

technologies

The introduction of microgyroscopes, miniature microphones, and

heat pipes

Design methodologies for thermally actuated multilayered device

components

The use of popular SU–8 polymer material

Supported by numerous examples, case studies, and applied

problems to facilitate understanding and real–world application,

the Second Edition will be of significant value for both

professionals and senior–level mechanical or electrical engineering

students.

Preface

Chapter  1: Overview of MEMS and Microsystems

　1.1 MEMS and Microsystem

　1.2 Typical MEMS and Microsystems Products

　1.3 Evolution of Microfabrication

　1.4 Microsystems and Microelectronics

　1.5 The Multidisciplinary Nature of Microsystems Design and

Manufacture

　1.6 Microsystems and Miniaturization

　1.7 Application of Microsystems in Automotive Industry

　1.8 Application of Microsystems in Other Industries

　1.9 Markets for Microsystems

　Problems

Chapter  2: Working Principles of Microsystems

　2.1 Introduction

　2.2 Microsensors

　2.3 Microactuation

　2.4 MEMS with Microactuators

　2.5 Microaccelerometers

　2.6 Microfluidics

　Problems

Chapter  3: Engineering Science for Microsystems Design and

Fabrication

　3.1 Introduction

　3.2 Atomic Structure of Matters

　3.3 Ions and Ionization

　3.4 Molecular Theory of Matter and Inter-molecular Forces

　3.5 Doping of Semiconductors

　3.6 The Diffusion Process

　3.7 Plasma Physics

　3.8 Electrochemistry

　Problems

Chapter  4: Engineering Mechanics for Microsystems

Design

　4.1 Introduction

　4.2 Static Bending of Thin Plates

　4.3 Mechanical Vibration

　4.4 Thermomechanics

　4.5 Fracture Mechanics

　4.6 Thin Film Mechanics

　4.7 Overview on Finite Element Stress Analysis

　Problems

Chapter  5: Thermofluid Engineering and Microsystems

Design

　5.1 Introduction

　5.2 Overview on the Basics of Fluid Mechanics in Macro and

Mesoscales

　5.3 Basic Equations in Continuum Fluid Dynamics

　5.4 Laminar Fluid Flow in Circular Conduits

　5.5 Computational Fluid Dynamics

　5.6 Incompressible Fluid Flow in Microconduits

　5.7 Overview on Heat Conduction in Solids

　5.8 Heat Conduction in Multi-layered Thin Films

　5.9 Heat Conduction in Solids in Submicrometer Scale

　Problems

Chapter  6: Scaling Laws in Miniaturization

　6.1 Introduction to Scaling

　6.2 Scaling in Geometry

　6.3 Scaling in Rigid-Body Dynamics

　6.4 Scaling in Electrostatic Forces

　6.5 Scaling of Electromagnetic Forces

　6.6 Scaling in Electricity

　6.7 Scaling in Fluid Mechanics

　6.8 Scaling in Heat Transfer

　Problems

Chapter  7: Materials for MEMS and Microsystems

　7.1 Introduction

　7.2 Substrates and Wafers

　7.3 Active Substrate Materials

　7.4 Silicon as a Substrate Material

　7.5 Silicon Compounds

　7.6 Silicon Piezoresistors

　7.7 Gallium Arsenide

　7.8 Quartz

　7.9 Piezoelectric Crystals

　7.10 Polymers

　7.11 Packaging Materials

　Problems

Chapter  8: Microsystems Fabrication Processes

　8.1 Introduction

　8.2 Photolithography

　8.3 Ion Implantation

　8.4 Diffusion

　8.5 Oxidation

　8.6 Chemical Vapor Deposition

　8.7 Physical Vapor Deposition - Sputtering

　8.8 Deposition by Epitaxy

　8.9 Etching

　8.10 Summary of Microfabrication

　Problems

Chapter  9: Overview of Micromanufacturing

　9.1 Introduction

　9.2 Bulk Micromanufacturing

　9.3 Surface Micromachining

　9.4 The LIGA Process

　9.5 Summary on Micromanufacturing

　Problems

Chapter  10: Microsystem Design

　10.1 Introduction

　10.2 Design Considerations

　10.3 Process Design

　10.4 Mechanical Design

　10.5 Mechanical Design Using Finite Element Method

　10.6 Design of Silicon Die of a Micropressure Sensor

　10.7 Design of Microfluidics Network Systems

　10.8 Computer-Aided Design

　Problems

Chapter  11: Assembly, Packaging and Testing of

Microsystems

　11.1 Introduction

　11.2 Overview of Microassembly

　11.3 The High Costs of Microassembly

　11.4 Microassembly Processes

　11.5 Major Technical Problems in Microassembly

　11.6 Microassembly Work Cells

　11.7 Challenging Issues in Microassembly

　11.8 Overview of Microsystems Packaging

　11.9 General Considerations in Packaging Design

　11.10 The Three Levels of Microsystems Packaging

　11.11 Interfaces in Microsystems Packaging

　11.12 Essential Packaging Technologies

　11.13 Die preparation

　11.14 Surface Bonding

　11.15 Wire bonding:

　11.16 Sealing and Encapsulation

　11.17 Three-dimensional Packaging

　11.18 Selection of Packaging Materials

　11.19 Signal Mapping and Transduction

　11.20 Design Case on Pressure Sensor Packaging

　11.21 Reliability in MEMS Packaging

　11.22 Testing for Reliability

　Problems

Chapter  12: Introduction to Nanoscale Engineering

　12.1 Introduction

　12.2 Micro and Nanoscale Technologies

　12.3 General Principle in Nanofabrication

　12.4 Nanoproducts

　12.5 Applications of Nanoproducts

　12.6 Quantum Physics

　12.7 Molecular Dynamics

　12.8 Fluid Flow in Submicrometer and Nano Scales

　12.9 Heat Conduction in Nanoscale

　12.10 Measurement of Thermal Conductivity

　12.11 Challenges in Nanoscale Engineering

　12.12 Social Impacts of Nanoscale Engineering

　Problems

　Bibliography

　Index.

　　Tai–Ran Hsu, PhD, is a Professor in the Department of

Mechanical and Aerospace Engineering, San Jose State University,

California. Dr. Hsu is the author of the earlier edition of this

book, which is considered one of the bestselling textbooks on the

subject of MEMS.

暂无出版社相关信息，正在全力查找中！

暂无相关书籍摘录，正在全力查找中！

在线阅读地址：Mems And Microsystems: Design, Manufacture, And Nanoscale Engineering, Second Edition 9780470083017在线阅读

在线听书地址：Mems And Microsystems: Design, Manufacture, And Nanoscale Engineering, Second Edition 9780470083017在线收听

在线购买地址：Mems And Microsystems: Design, Manufacture, And Nanoscale Engineering, Second Edition 9780470083017在线购买

暂无原文赏析，正在全力查找中！

编辑推荐

　　Technology/Engineering/Mechanical

　　A bestselling MEMS text...now better than ever.

　　An engineering design approach to Microelectromechanical Systems,

MEMS and Microsystems remains the only available text to cover both

the electrical and the mechanical aspects of the technology. In the

five years since the publication of the first edition, there have

been significant changes in the science and technology of

miniaturization, including microsystems technology and

nanotechnology. In response to the increasing needs of engineers to

acquire basic knowledge and experience in these areas, this popular

text has been carefully updated, including an entirely new section

on the introduction of nanoscale engineering.

　　Following a brief introduction to the history and evolution of

nanotechnology, the author covers the fundamentals in the

engineering design of nanostructures, including fabrication

techniques for producing nanoproducts, engineering design

principles in molecular dynamics, and fluid flows and heat

transmission in nanoscale substances.

　　Other highlights of the Second Edition include:

　　Expanded coverage of microfabrication plus assembly and packaging

technologies

　　The introduction of microgyroscopes, miniature microphones, and

heat pipes

　　Design methodologies for thermally actuated multilayered device

components

　　The use of popular SU-8 polymer material

　　Supported by numerous examples, case studies, and applied

problems to facilitate understanding and real-world application,

the Second Edition will be of significant value for both

professionals and senior-level mechanical or electrical engineering

students.

书籍介绍

在线阅读本书

Technology/Engineering/Mechanical

A bestselling MEMS text...now better than ever.

An engineering design approach to Microelectromechanical Systems, MEMS and Microsystems remains the only available text to cover both the electrical and the mechanical aspects of the technology. In the five years since the publication of the first edition, there have been significant changes in the science and technology of miniaturization, including microsystems technology and nanotechnology. In response to the increasing needs of engineers to acquire basic knowledge and experience in these areas, this popular text has been carefully updated, including an entirely new section on the introduction of nanoscale engineering.

Following a brief introduction to the history and evolution of nanotechnology, the author covers the fundamentals in the engineering design of nanostructures, including fabrication techniques for producing nanoproducts, engineering design principles in molecular dynamics, and fluid flows and heat transmission in nanoscale substances.

Other highlights of the Second Edition include: Expanded coverage of microfabrication plus assembly and packaging technologies The introduction of microgyroscopes, miniature microphones, and heat pipes Design methodologies for thermally actuated multilayered device components The use of popular SU–8 polymer material

Supported by numerous examples, case studies, and applied problems to facilitate understanding and real–world application, the Second Edition will be of significant value for both professionals and senior–level mechanical or electrical engineering students.